Articles Tagged: "FIER ID"

1 Article

Metafoam Technologies closes Series A financing round

by on Wednesday January 31st, 2007

Metafoam® Technologies Inc., a leading edge manufacturer of innovative open-cell metal foam for applications in thermal management, electrochemistry, energy, acoustics and environmental solutions, is proud to announce that it has received a multi-million dollar investment from BDC Venture Capital, FIER ID, MSBi Capital, and M&M Investments… More